何伟，男，中共党员，工学博士。2025年11月于南京理工大学能源与动力工程学院获工学博士学位，同年入职伟德源自英国始于1946。主要从事电子器件与芯片热管理及微电子先进封装方向的研究工作。近年来在传热与微电子封装领域权威期刊发表SCI论文十余篇。参与了多项国家重点研发计划、国家自然科学基金重大项目等科研项目的技术攻关工作。

电子器件/芯片先进热管理研究；微电子封装及多物理场耦合研究

[1] Wei He, Ershuai Yin, Fan zhou, Yangzhao, Dinghua Hu, Jiaqi Li^*, Qiang Li^*. Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology[J], Energy, 2024, 305: 132263.

[2]Wei He, Yangzhao, Dinghua Hu, Jiaqi Li^*, Qiang Li^*. Integrated Embedded Cooling Method for Thermal Management in Multilayer Ceramic Circuit Substrate Microsystems for Multi-Chip Components [J], International Communications in Heat and Mass Transfer, 2025, 165, 109005.

[3] Wei He, Jianhong Zhou, Xuemei Chen, Jiaqi Li^*, Qiang Li^*. Multi-field coupling in designing embedded microchannels for three-dimensional integrated chip: A topology optimization approach[J], Applied Thermal Engineering, 2024, 248:123218.

[4] Wei He, Jiaqi Li^*, Qiang Li^*. Optimized Design of Multilayer Embedded Micro-Fins for Enhanced Thermal Management in three-dimensional stacked chips with Heterogeneous Heat Source [J], Case Studies in Thermal Engineering, 2024, 64, 105490.

[5] Wei He, Zixuan Wang, Jiaqi Li^*, Qiang Li^*. Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips [J], International Journal of Heat and Mass Transfer, 2023,214, 124442.

[6] Wei He, Ershuai Yin^*, Qiang Li^*. Multiobjective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3-D Integrated Chips [J], IEEE Transactions on Components, Packaging, and Manufacturing Technology, VOL. 12, NO. 8, AUGUST 2022.

[7] Wei He, Chunyue Huang*, Liang Ying. Analysis of Thermal Stress and Strain in BGA Solder Joint Based on Microchannel Ceramic Substrate [J], IEEE Transactions on Components, Packaging, and Manufacturing Technology, VOL. 9, NO. 5, MAY 2019. 

[8] Wei He, Jiaqi Li^*, Qiang Li^*. Investigation of Embedded Microchannel Heat Transfer Performance Based on High Power Integrated Chip [J], 25th International Conference on Electronic Packaging Technology (ICEPT). 2024 Tian Jing.

[9] Weiqiang Niu,Wei He, Jiaqi Li^*, Qiang Li^*. Optimizing thermal performance in High-power-density 3D integrated circuits through advanced microchannel structures and multi-layer cooling. Applied Thermal Engineering, 2025, 262:125281.

[10] Hongxing Liu, Wei He, Weiqiang Niu, Jiaqi Li^*, Qiang Li^* .Optimization of Embedded Cooling in 2.5D Integrated Circuits through Genetic Algorithm-Driven TSV Layout Design[J], Energy, 2025, 332: 137265.

[11] Xinrui Zhang, Linwei Cao, Wei He, QiangLi, Quanfeng Zhou, Dinghua Hu. Experimental and numerical study of CVD diamond microchannel cooling for high heat flux heterogeneous material-integrated dies, International Journal of Heat and Mass Transfer, 2026,255, 127836.